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| LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT TAPE AND REEL Pb Lead-Free Parts LDGM9033/TR1 DATA SHEET DOC. NO REV DATE : QW0905- LDGM9033/TR1 :A : 04 - Aug - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM9033/TR1 Page 1/7 Package Dimensions Cathode 4.6O 0.5 2.5 0.4O 0.1 0.5O 0.1 2.0 r 1.9 1.4 2.8 0.16 0.7 0.4 Note : 1.All dimension are in millimeter tolerance is O 0.2mm unless otherwise noted. 2.Specifications are subject to change without notice. Carrier Type Dimensions 4.0 2.16 0.3 9.3 120.3 5.5 4.85 Polarity 1.75 4.0 3.32 2.0 1.5 Note : The tolerances unless mentioned is O 0.2mm,Angle O 0.5. Unit=mm. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM9033/TR1 Page 2/7 Reel Dimensions 16.0O 1.0 r 178O 2.0 14.2O 1.0 74.0O 1.5 Part No. LDGM9033/TR1 Description 12.0mm tape,7"reel Quantity/Reel 1500 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LDGM9033/TR1 Page 3/7 Absolute Maximum Ratings at Ta=25 J Ratings Parameter Symbol DGM Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 30 100 120 50 150 -20 ~ +80 -30 ~ +100 Max 260J for 5 sec Max (2mm from body) mA mA mW UNIT g A J J Typical Electrical & Optical Characteristics (Ta=25 J ) PART NO MATERIAL COLOR Luminous Viewing Peak Dominant Spectral Forward intensity angle wave wave halfwidth voltage @20 mA(V) @20mA(mcd) 2c 1/2 length length f nm (deg) f Pnm f Dnm Emitted LDGM9033/TR1 InGaN/GaN Green Lens Water Clear 518 525 36 Typ. Max. Min. 3.5 Typ. 20 4.0 1100 1800 Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM9033/TR1 Page 4/7 Typical Electro-Optical Characteristics Curve DGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1000 3.0 Forward Current(mA) 100 Relative Intensity Normalize @20mA 1.0 2.0 3.0 4.0 5.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000 10 1.0 0.1 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Forward Voltage@20mA Normalize @25J Relative Intensity@20mA Normalize @25J 80 100 1.1 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.0 0.9 0.8 -40 -20 0 20 40 60 Ambient Temperature(J ) Ambient Temperature(J ) Fig.5 Relative Intensity vs. Wavelength 1.0 Relative Intensity@20mA 0.5 0.0 450 500 550 600 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LDGM9033/TR1 Recommended Soldering Conditions 1. Hand Solder Basic spec is O 280J 3 sec one time only. Page 5/7 2. Wave Solder Soldering heat Max. 260J 245O 5J within 5 sec Preheat 120 ~ 150J 120 ~ 180 sec 3-1. LEAD Reflow Solder Temp. (J ) 240 Rising +5J /sec Cooling -5J /sec 150 120 Preheat 60 ~ 120 sec 5sec Time 3-2 PB-Free Reflow Solder 1~5 C/sec 260 C MaX. 10sec.Max Preheat 180~200 C 1~5 C/sec Above 220 C 60 sec.Max. 120 sec.Max. Reflow Soldering should not be done more than two times. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LDGM9033/TR1 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5J ~35J ,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 J ~ 35J ,RH60%, they should be treated at 60JO 5 J fo r 15hrs. Page 6/7 Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value. Circuit model A LED Circuit model B LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LDGM9033/TR1 Page 7/7 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65JO 5J 2.RH=90 %~95 % 3.t=240hrs O 2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 JO 5J &-40JO (10min) (10min) 2.total 10 cycles 5J The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 |
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